Dale N. Seed
Dale Seed is a Principal Engineer and member of the Internet of Things (IoT) R&D team at InterDigital. Dale serves as the lead architect of InterDigital’s M2M/IoT Platform. Dale is also an active participant in M2M/IoT industry standards bodies such as oneM2M, IETF, and 3GPP. As an employee of InterDigital, Dale is also a member of Convida Wireless which is a Joint Venture partnership between InterDigital and Sony focused on researching future IoT technology areas.
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