Welcome to the IoT Grand Slam 2018, VIRTUAL Internet of Things Conference, December 11th 2018 held in the Cloud.

Dale N. Seed

Principal Engineer and member of the Internet of Things (IoT) R&D team at InterDigital

Dale N. Seed

Principal Engineer and member of the Internet of Things (IoT) R&D team at InterDigital

Biography

Dale N. Seed

interdigital-squarelogoDale Seed is a Principal Engineer and member of the Internet of Things (IoT) R&D team at InterDigital.  Dale serves as the lead architect of InterDigital’s M2M/IoT Platform.  Dale is also an active participant in M2M/IoT industry standards bodies such as oneM2M, IETF, and 3GPP.  As an employee of InterDigital, Dale is also a member of Convida Wireless which is a Joint Venture partnership between InterDigital and Sony focused on researching future IoT technology areas.

Join our IoT Community at https://www.linkedin.com/groups/4662022/profile 

IoT Grand Slam Virtual Internet of Things Conference

IoT Slam Internet of Things Conference, Bryson Koehler

All session by Dale N. Seed