Welcome to the IoT Slam Live 2019, Internet of Things Conference - The Trilogy. June 20-21 2019, R.T.P North Carolina U.S.A

Dale N. Seed

Principal Engineer and member of the Internet of Things (IoT) R&D team at InterDigital

Dale N. Seed

Principal Engineer and member of the Internet of Things (IoT) R&D team at InterDigital

Biography

Dale N. Seed

interdigital-squarelogoDale Seed is a Principal Engineer and member of the Internet of Things (IoT) R&D team at InterDigital.  Dale serves as the lead architect of InterDigital’s M2M/IoT Platform.  Dale is also an active participant in M2M/IoT industry standards bodies such as oneM2M, IETF, and 3GPP.  As an employee of InterDigital, Dale is also a member of Convida Wireless which is a Joint Venture partnership between InterDigital and Sony focused on researching future IoT technology areas.

Join our IoT Community at https://www.linkedin.com/groups/4662022/profile 

IoT Grand Slam Virtual Internet of Things Conference

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All session by Dale N. Seed